Multiple heatsink cooling system for a line voltage thermostat

ABSTRACT

A line voltage thermostat having a multiple heatsink switch. A total switch may have a semiconductor switch mounted on each heatsink of the multiple heatsink switch. The semiconductor switches of the respective heatsinks may be connected in parallel to represent the total switch. Each of the two or more heatsinks, having a semiconductor switch for switching, and in total conveying the same power as one equivalent switch with one total heatsink, may have higher maximum operating temperatures and higher thermal resistances than twice the thermal resistance of the one total heatsink. The two or more heatsinks may be situated within a housing of the line voltage thermostat, and be easier to distribute in the housing to achieve an efficient layout of a display and control buttons for the thermostat.

BACKGROUND

The present disclosure pertains to switches and particularly to heatsinks associated with the switches. More particularly, the disclosure pertains to switches for thermostats.

SUMMARY

The disclosure reveals a line voltage thermostat having a multiple heatsink switch. A total switch may have a semiconductor switch mounted on each heatsink of the multiple heatsink switch. The semiconductor switches of the respective heatsinks may be connected in parallel to represent the total switch. Each of the two or more heatsinks, having a semiconductor switch for switching, and in total conveying the same power as one equivalent switch with one total heatsink, may have higher maximum operating temperatures and higher thermal resistances than twice the thermal resistance of the one total heatsink. The two or more heatsinks may be situated within a housing of the line voltage thermostat, and be easier to distribute in the housing to achieve an efficient layout of a display and control buttons for the thermostat.

BRIEF DESCRIPTION OF THE DRAWING

FIG. 1 is a diagram of an illustrative thermostat, a power source and an electric load;

FIG. 2 is a diagram of thermal conductivity of an example triac arrangement;

FIG. 3 is a diagram that illustrates a two-heatsink principle with an example layout of two SCR/triac and respective heatsink assemblies

FIG. 4 a is a diagram of layout of a housing design that indicates an integration of the double SCR/triac arrangement in a product rather than a single triac arrangement;

FIG. 4 b is a diagram of some layouts of a housing design;

FIG. 5 is a diagram of housings of a commercial thermostat and a two heatsink configuration for illustrating a size, display and layout comparison; and

FIG. 6 is a diagram of a graph that shows a non-linear relationship between mass and thermal resistance for various models of thermostats.

DESCRIPTION

The present system and approach may incorporate one or more processors, computers, controllers, user interfaces, wireless and/or wire connections, and/or the like, in an implementation described and/or shown herein.

This description may provide one or more illustrative and specific examples or ways of implementing the present system and approach. There may be numerous other examples or ways of implementing the system and approach.

Line voltage thermostats may be used to direct control of an electrical heater. High electrical power going through the switching component in the thermostat produces excessive heat that may damage the component itself. A single heatsink may be traditionally used in order to cool down the switching component.

Often, a heat sink may take up to two-thirds of a thermostat envelope and create many integration constraints. Such thermostat arrangement may have a bulky size, a limited screen size, limited positions of the screen due to a heat source location, and limited positions for button locations.

The present arrangement may incorporate two separate switching components such as triacs or SCRs (e.g., thyristors) and have each component installed with its own heat sink in the envelope. The arrangement may permit each switching component to run at a higher tab temperature since it has half of the original power going through it while having the same junction temperature as the single component arrangement. The arrangement may incorporate more than two components and corresponding heat sinks.

The thermal performance of a heat sink may be a nonlinear function of the heat sink's overall size. Heat sinks of smaller size may be more efficient.

In order for the present arrangement operate at its best in an envelope, both heat sinks should be the furthest apart from each other. Advantages of the present arrangement compared to a single switching component envelope, for instance that of a thermostat, may incorporate a smaller overall product and better aesthetics, or (if envelope size is kept constant) a higher power rating. The arrangement may result in a better integration of screen such as a more favorable centering the screen and yet keeping it far from a heat source, a possibility of larger screen, and a centering of the buttons.

The present arrangement may be used to improve the aesthetics of a product such as the thermostat by reducing its size or increasing its power rating without reducing its size. The arrangement may provide more flexibility for human machine interface components integration such as a screen and buttons. A new thermostat look and/or higher power rating may create a significantly competitive advantage in the market.

RF/heatsink compatibility (RF mechanical specifications) and RF maximum temperature requirements (RF thermal specifications) may be a consideration with the present arrangement. A printed circuit board (PCB) thermal model may incorporate dissipated power from other electronic components other than the triac, thermal resistance of the power traces, a position of a compensation sensor, and ambient sensor thermal cooling and position.

Factors of concern may incorporate sizes and positions of electronic components, a position of compensation sensor, ambient sensor thermal cooling and position, high temperature LCD and backlight, and thermopheresis (black soot deposition).

FIG. 1 is a diagram of an illustrative thermostat 71, a power supply or source 72 and an electric load 73. Thermostat 71 may incorporate a temperature setpoint mechanism or device 74, a device, microcontroller or mechanism 75 having a comparator function, and a power switch 76. The comparator function may be performed by an electronic or mechanical device, mechanism, or by a microcontroller. Thermostat 71 may be connected to a temperature sensor 77. Temperature sensor 77 may be in thermostat 71 or remote from thermostat 71. Power supply 72 may be connected to a power switch or switching component 76 of thermostat 71. An electric load 73 may be connected to power switch 76 and power supply 72. Electric load 73 may be a heater. Temperature sensor 77 and electric load 73 may be situated in the same area or space. Temperature indications from temperature setpoint device 74 and temperature sensor 77 may go to comparator function of a mechanism 75. Mechanism 75 with a comparator function may determine from the indications whether power switch 76 should be closed or not, relative to connecting electric load or heater 73 to power supply 72.

Power in a room may be controlled by a duty cycle on the full power to the electric load or heater 73: time on/(time on+time off). For example, 7.5 seconds on and 7.5 seconds off every 15 seconds on a 1000 W baseboard heater may be 50 percent of 1000 W=500 W of power delivered.

Thermostat 71 may also incorporate additional electronics and interface components 78 that may be connected with one or more components inside and outside of the diagram in FIG. 1. Electronics and interface components 78 may provide various functions of calculation, processing and power control of thermostat system 71.

FIG. 2 is a diagram of a thermal conductivity of an example triac arrangement 11. A triac 12 may be connected to the ambient air 14 via wires, PCB and thermostat structure, and represented by the thermal resistance 13 (Rwires). The other side of triac 12 may be connected to the ambient air 14 via a flat surface heatsink 18 with a conductive adhesive or other material 19, and represented by the thermal resistance 16 (Rhs).

FIG. 3 is a diagram that illustrates a two-heatsink principle with an example layout of two SCR/triac and respective heatsink assemblies 31 and 32. An approximation or equivalent of the SCR assemblies may be shown in terms of one triac assembly 33. For the same total “q” (energy) of assemblies 31 and 32 together being the same for the single triac assembly 33, the thermal resistance of the junction the triac (Rjc), heatsink (Rhs), and connecting wires (Rwires) may be about one-half for assembly 33 of that for an SCR assembly.

Advantages of a two or more SCR/triac arrangement may incorporate that each SCR/triac may operate at a higher temperature and its heatsink may be smaller than a single triac arrangement. For instance, the triac maximum tab temperature may be indicated by the formula Tj−Rjc*P=104−0.97*17.5=87° C. The double triac/SCRs maximum tab temperature may be indicated by the formula Tj−Rjc*P=104−1*17.5/2=95° C. A smaller heatsink of a SCR or triac of a double arrangement may equate to a higher thermal resistance heatsink than twice the thermal resistance of a single triac.

Heatsink thermal resistance for a triac may be indicated by the formula Rth=(Tc−Ta)/P=(87−25)/17.5=3.54° C./W; twice that value is 7.08° C./W. The mass for the triac arrangement may be 90 g. Heatsink thermal resistance for a double triac/SCR arrangement may be indicated by the formula Rth=(Tc−Ta)/P=(95−25)/8.75=8° C./W. The mass for the double arrangement may be 30 g; twice that value is 60 g.

FIG. 4 a is a diagram of layout 41 of a housing 46 design that may indicate a better integration of the double SCR/triac arrangement in a product than a single triac arrangement. FIG. 4 b is a diagram of layouts 42 and 43 of housing design 46. A placement of the two SCR/triac and heatsink assemblies 31 and 32 are revealed in layouts 41 and 43. Advantages of the design may incorporate a centered LCD 45 as shown in layouts 41 and 42. Display 45 may instead be of a non-LCD technology. Display 45 may have dimensions of 24 mm×48 mm. Other dimensions of components in housing 46 may incorporate a PCB area of 8500 mm² (for comparison, see a Honeywell TH104 PCB=5100 mm²), with no wall plate required (a cost saving), a slim structure with a vertical concept (34 mm), straight fins, and a 50 percent aluminum weight reduction, as compared with the OEM637 noted herein.

FIG. 5 is a diagram of housings of a Honeywell TH104 thermostat 51 and a two heatsink configuration for illustrating a size, display and layout comparison.

FIG. 6 is a diagram of a graph 61 that shows a non-linear relationship between mass and thermal resistance for various models of thermostats. Point 62 represents the calculation for the triac and point 63 represents the calculation for each SCR noted herein.

To recap, a thermostat for controlling an electric heater may incorporate an ambient temperature sensor, a temperature setpoint device, a comparator mechanism connected to the ambient temperature sensor and the temperature setpoint device, and a power switch having a control terminal connected to the comparator mechanism. The power switch may incorporate two or more separate heatsinks and a solid state switch situated on each heatsink. Each solid state switch may have a control input connected to the control terminal of the power switch.

The thermostat may further incorporate a housing. The temperature setpoint device, the comparator mechanism and the power switch may be situated in the housing.

The ambient temperature sensor may be for indicating a temperature of a space containing an electric heater connected to the power switch, and for providing an output signal to the control terminal of the power switch or no output signal to the control terminal of the power switch.

The comparator mechanism may compare a first temperature indication from the ambient temperature sensor and a second temperature indication from the temperature setpoint device and provide a first output signal, a second output signal or no output signal to the control terminal of the power switch. The first output signal may indicate that the second temperature indication is X degrees greater than the first temperature indication. The second output signal may indicate that the first temperature indication is Y degrees greater than the second temperature indication. X may be a predetermined number. Y may be a predetermined number.

The first output signal may turn on the power switch. The second output signal may turn off the power switch. When the power switch is turned off, the electric heater may be disconnected from electric power. When the power switch is turned on, the electric heater may be connected to electric power.

The solid state switch may be selected from a group consisting of an SCR and a triac.

Each heatsink and corresponding solid state switch may be placed in the housing at a distance from any other heatsink. The distance may be set at a maximum within the housing.

An approach, for controlling an electric load, may incorporate providing a thermostat having a power switch connectable to an electric load, determining how much power is to be delivered by an electric load, designating an amount of time the electric load is to be powered, and designing a power switch capable of turning on and off the power of an electric load, having two or more solid state switches connected in parallel and attached to separate heatsinks. Each of the two or more solid state switches may be capable of turning on and off the power of the electric load.

The approach may further incorporate measuring a temperature of a space having a temperature to be controlled, selecting a desired temperature to be provided to the space, and connecting the electric load to power with the power switch if the temperature of the space is less than the desired temperature. The electric load may provide heat in the space to raise the temperature in the space when the electric load is connected to the power.

The measuring the temperature in the space, selecting the desired temperature, and providing a signal to the power switch to connect the electric load to power may be performed by a temperature sensor, a temperature setpoint device, and a comparator mechanism, respectively.

The temperature setpoint device, the comparator mechanism and the power switch may be contained within a housing. The housing may have a thermostat that incorporates the temperature sensor, the temperature setpoint device, and the comparator mechanism.

A heatsink cooling system for a line voltage thermostat may incorporate a switching component and a thermostatic control. The switching component may incorporate two or more heatsinks, and a semiconductor switch situated on each of the two or more heatsinks. Each semiconductor switch may have an input connectable to a line voltage and an output connectable to an electric load, and have a control terminal. The thermostatic control may have an output connected to the control terminal of each semiconductor switch.

The thermostatic control may incorporate a housing, a temperature sensor, a temperature setpoint mechanism, and an electronics module connected to the temperature sensor, the temperature setpoint mechanism, and the output of the thermostatic control.

The temperature setpoint mechanism may be accessible on the housing or be remote from the housing. The electronic module may be situated in the housing. The switching component may be situated in the housing.

The two or more heatsinks may be situated in the housing at a maximum distance from one another within the housing.

Increasing a number of heatsinks with the switching component having a semiconductor switch situated on each heatsink of a number of heatsinks greater than one, may increase a maximum operating tab temperature for each semiconductor switch and result in each of the more than one heatsinks having a thermal resistance greater than a heatsink of a switching component if the switching component has a total of one semiconductor switch situated on just one heatsink for the same amount electric load carried by the switching component having two or more semiconductor switches with each semiconductor switch having at least one heatsink. The semiconductor switch may be selected from a group consisting of a SCR and a triac.

The electric load may incorporate an electric heater in a space having a temperature that can be measured by the temperature sensor.

The mass of the two or more heatsinks of the switching component having two or more semiconductor switches may be less than the mass of a heatsink of the switching component having just one semiconductor switch on one heatsink for the same electrical load.

In the present specification, some of the matter may be of a hypothetical or prophetic nature although stated in another manner or tense.

Although the present system and/or approach has been described with respect to at least one illustrative example, many variations and modifications will become apparent to those skilled in the art upon reading the specification. It is therefore the intention that the appended claims be interpreted as broadly as possible in view of the related art to include all such variations and modifications. 

1. A thermostat for controlling an electric heater comprising: an ambient temperature sensor; a temperature setpoint device; a comparator mechanism connected to the ambient temperature sensor and the temperature setpoint device; a power switch having a control terminal connected to the comparator mechanism; and wherein the power switch comprises: two or more separate heatsinks; a solid state switch situated on each heatsink; and wherein each solid state switch has a control input connected to the control terminal of the power switch.
 2. The thermostat of claim 1, further comprising: a housing; and wherein the temperature setpoint device, the comparator mechanism and the power switch are situated in the housing.
 3. The thermostat of claim 1, wherein the ambient temperature sensor is for indicating a temperature of a space containing an electric heater connected to the power switch, and for providing an output signal to the control terminal of the power switch or no output signal to the control terminal of the power switch.
 4. The thermostat of claim 1, wherein: the comparator mechanism compares a first temperature indication from the ambient temperature sensor and a second temperature indication from the temperature setpoint device and provides a first output signal, a second output signal or no output signal to the control terminal of the power switch; the first output signal indicates that the second temperature indication is X degrees greater than the first temperature indication; the second output signal indicates that the first temperature indication is Y degrees greater than the second temperature indication; X is a predetermined number; and Y is a predetermined number.
 5. The thermostat of claim 4, wherein: the first output signal turns on the power switch; and the second output signal turns off the power switch.
 6. The thermostat of claim 5, wherein: when the power switch is turned off, the electric heater is disconnected from electric power; and when the power switch is turned on, the electric heater is connected to electric power.
 7. The thermostat of claim 1, wherein the solid state switch is selected from a group consisting of an SCR and a triac.
 8. The thermostat of claim 2, wherein: each heatsink and a corresponding solid state switch are placed in the housing at a distance from any other heatsink; and the distance is set at a maximum within the housing.
 9. A method, for controlling an electric load, comprising: providing a thermostat comprising a power switch connectable to an electric load; determining how much power is to be delivered by an electric load; designating an amount of time the electric load is to be powered; and designing a power switch capable of turning on and off the power of an electric load, incorporating two or more solid state switches connected in parallel and attached to separate heatsinks; and wherein each of the two or more solid state switches is capable of turning on and off the power of the electric load.
 10. The method of claim 9, further comprising: measuring a temperature of a space having a temperature to be controlled; selecting a desired temperature to be provided to the space; and connecting the electric load to power with the power switch if the temperature of the space is less than the desired temperature; and wherein the electric load provides heat in the space to raise the temperature in the space when the electric load is connected to the power.
 11. The method of claim 10, wherein the measuring the temperature in the space, selecting the desired temperature, and providing a signal to the power switch to connect the electric load to power are performed by a temperature sensor, a temperature setpoint device, and a comparator mechanism, respectively.
 12. The method of claim 11, wherein the temperature setpoint device, the comparator mechanism and the power switch are contained within a housing.
 13. The method of claim 12, wherein the housing incorporates a thermostat that comprises the temperature sensor, the temperature setpoint device, and the comparator mechanism.
 14. A heatsink cooling system for a line voltage thermostat comprising: a switching component; and a thermostatic control; and wherein: the switching component comprises: two or more heatsinks; and a semiconductor switch situated on each of the two or more heatsinks; and wherein each semiconductor switch has an input connectable to a line voltage and an output connectable to an electric load, and has a control terminal; and the thermostatic control has an output connected to the control terminal of each semiconductor switch.
 15. The system of claim 14, wherein the thermostatic control comprises: a housing; a temperature sensor; a temperature setpoint mechanism; and an electronics module connected to the temperature sensor, the temperature setpoint mechanism, and the output of the thermostatic control.
 16. The system of claim 15, wherein: the temperature setpoint mechanism is accessible on the housing or is remote from the housing; the electronic module is situated in the housing; and the switching component is situated in the housing.
 17. The system of claim 16, wherein the two or more heatsinks are situated in the housing at a maximum distance from one another within the housing.
 18. The system of claim 16, wherein increasing a number of heatsinks with the switching component having a semiconductor switch situated on each heatsink of a number of heatsinks greater than one, increases a maximum operating tab temperature for each semiconductor switch and results in each of the more than one heatsinks having a thermal resistance greater than a heatsink of a switching component if the switching component has a total of one semiconductor switch situated on just one heatsink for the same amount electric load carried by the switching component having two or more semiconductor switches with each semiconductor switch having at least one heatsink.
 19. The system of claim 15, wherein the electric load comprises an electric heater in a space having a temperature that can be measured by the temperature sensor.
 20. The system of claim 14, wherein the semiconductor switch is selected from a group consisting of a SCR and a triac.
 21. The system of claim 18, wherein the mass of the two or more heatsinks of the switching component having two or more semiconductor switches is less than the mass of a heatsink of the switching component having just one semiconductor switch on one heatsink for the same electrical load. 